Littelfuse’s K5V series of illuminated tactile switches now include gull-wing and 2.1-mm PIP versions compatible with reflow ...

Solderstar will exhibit its Reflow Shuttle O₂, designed for nitrogen-assisted reflow soldering processes innovations at SMTA.

You have some fine pitch soldering to do, but all you have on hand is a big soldering iron. What do you do? There are a few possible answers, but [Mr SolderFix] likes to pull a strand from a large ...

Warpage of dies, redistribution layers, and interposers is a growing problem in multi-chiplet packages, and it can have a dramatic impact on the behavior and reliability of these devices. Multiple ...

Abstract: In electronic packaging technology, the thermal behavior during reflow soldering critically influences solder joint quality and even device reliability. This study proposes a finite element ...

Littelfuse announced the expansion of its K5V Series illuminated Tactile Switch family with the release of new K5V4 models. These include Gull Wing (GH) and 2.1 mm Pin-in-Paste (PIP) versions that are ...

Abstract: Mass reflow soldering technology using flux have been widely adopted in semiconductor assembly process for decades, particularly in ball grid array (BGA) solder ball attachment process.