Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 ...
Academic researchers have devised a new variant of Rowhammer attacks that bypass the latest protection mechanisms on DDR5 memory chips from SK Hynix. A Rowhammer attack works by repeatedly accessing ...
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