The first step for semiconductor chips is visual inspection using an optical microscope or electrical measurements. 2 Mechanical probing, electron beams, emission microscopy, liquid crystal, etc., are ...

Two expectations informed end-users have of electric motor service centers are reliable best practice repairs and root cause failure analysis (RCFA) to prevent recurring failures. Service centers ...

Failure analysis is one of the best tools for any aerospace supplier or manufacturer. The scientific method-based approach to establishing cause and effect can be used across all phases of a product's ...

The authors’ findings suggest that even if each individual method reduces risk, their correlated vulnerabilities collectively ...

Background The minimally important difference (MID) for frailty variation associated with adverse outcomes remains unknown in ...

Failure analysis (FA) is an essential step for achieving sufficient yield in semiconductor manufacturing, but it’s struggling to keep pace with smaller dimensions, advanced packaging, and new power ...

Experts at the Table: Semiconductor Engineering sat down to discuss how increasing complexity in semiconductor and packaging technology is driving shifts in failure analysis methods, with Frank Chen, ...

These developments continue to fuel growing investment into the technology and manufacture of semiconductor devices at both industrial and academic research levels. Improvements in technology, ...

Analyzing failures in printed circuit boards (PCBs) is critical to ensure the functionality and reliability of electronic devices. A synopsis of the methods and techniques utilized in PCB failure ...

In my two previous columns, I discussed the lower and intermediate levels of the building block approach for crashworthiness testing and analysis of composite structures. I focused on the commercial ...